Fullgory Technology Co., Ltd. utilizes an advanced packaging technology, which has been used in Europe and America, Low Pressure Molding (LPM) technology, with Hot-melt adhesive (polyamide and polyolefin) to capsulate precise electronic components. Because LPM’s injection pressure is small, molding temperature is low, will not damage the components be capsulated and effectively improve molding process yield rate. After completing component encapsulation, it will have the advantages with insulation, impact resistance, and waterproof, resistant to high temperature, dust and corrosion resistance.
LPM uses Hot-melt adhesive of high-liquidity, which is injected into mold with low pressure (1.5～40bar), it is cured fast (5~50 seconds) and has excellent sealing effect.
The component capsulation layer of LPM could be produced to irregular outline, thickness according to different requirements. It can eliminate the housing produced by traditional plastic ejection.
Comparing “Low Pressure Molding” and traditional plastic “Ejection Molding”, the former (LPM) has the advantages of small size of finished product, higher degree of freedom of product shape and higher yield rate of molding.
Fullgory Technology Co., Ltd. accepts ODM of LPM requirement of customers, with own plastic factory, self-made mold, good technology, is suitable for the precision components packaging of electronics and automotive industry, such as PCB, coils, wiring harness, waterproof connector, micro-switches, sensors,..etc.